Numerical study on thermal stress cutting of silicon wafer using two-point pulsed laser - Liu, Jian; Lu, Jian; Ni, Xiaowu; Dai, Gang; Zhang, Liang; Chen, Yanbei (Oficyna Wydawnicza Politechniki Wrocławskiej, 2011)
Optica Applicata, Vol. 41, 2011, Nr 1, s. 247-255
Keywords: optyka; brittle materials; thermal stress; laser cutting