@misc{Prószyński_Adam_Stress_2009,
 author={Prószyński, Adam and Chocyk, Dariusz and Gładyszewski, Grzegorz},
 contributor={Gaj, Miron. Redakcja and Urbańczyk, Wacław. Redakcja},
 year={2009},
 rights={Wszystkie prawa zastrzeżone (Copyright)},
 publisher={Oficyna Wydawnicza Politechniki Wrocławskiej},
 description={Optica Applicata, Vol. 39, 2009, nr 4, s. 705-710},
 language={eng},
 abstract={Stress evolution during deposition of 50 nm Au thin films by thermal evaporation in a UHV system and then stress modification during thermal vacuum annealing have been performed. For stress measurement a substrate curvature approach has been applied. The changes in stress versus temperature linked to a modification of microstructure has been interpreted. To obtain any information about structural changes in the film X-ray diffraction measurements has been performed. We can conclude from the measurements that during the first cycle some irreversible structural modifications occur in a metal film.},
 title={Stress modification in gold metal thin films during thermal annealing},
 type={artykuł},
 keywords={optyka, thin films, annealing, strain, stress},
}